Lead-free Solder Paste

Product Description:

solder paste, lead free solder paste, gree paste, Non-hydrophilic, good solderability even under high temperature and humidity 

Sn-58Bi lead free solder paste:

Melting point: 139oC

Spec gravity: 4.5-5.0

Flash Point: ≥300oC

Characteristics:   

Printing characteristic: good solderability even at peak temperature   

Usage: if the solder paste is taken out of the refrigerator, it must be placed at an environment of 25 for about 4 hours so as to make its temperature return to indoor one before any scraping, shoveling, stirring etc. Otherwise, the cold solder paste may be damped, causing tin balls.   

Printing conditions: As it is non-hydrophilic, the solder paste should be used at indoor temperature or under an environment of relatively high humidity, the maximum of which could reach 80%.