Loading Port:Shanghai
Payment Terms:TT OR LC
Min Order Qty:-
Supply Capability:339 ton kg/month
1、基材参数Base Copper Parameter
铜基材Base Material | TU1 oxygen-free C10200 |
成分含量 Content | CU＞99.97% |
导电率 Electrical conductivity | ≥100% IACS |
电阻系数Resistivity | ≤0.017241Ωmm2/m |
2、涂层成分Soldercomposition
涂层成分 Solder Type | 涂层成分比例 Solder composition rate | 单面涂层厚度(mm) Solder Single Thickness(mm) | 涂层厚度公差（mm） Solder Thickness Tolerance(mm) |
含铅 (Leaded) | Sn60%Pb40% | 0.01-0.04 | ±0.005 |
Sn63%Pb37% | 0.01-0.04 | ±0.005 | |
Sn62%Pb36%Ag2% | 0.01-0.04 | ±0.005 | |
无铅(Lead-free) | Sn97%Ag3% | 0.01-0.04 | ±0.005 |
其他成分比例可根据客户工艺要求定制Other solder composition available according to customer’s technical requirement | |||
3、产品几何尺寸及公差Physical Dimension and Tolerance
类别 Type | 厚度范围及公差(mm) Thickness Range and Tolerance(mm) | 宽度范围及公差(mm) Width Range and Tolerance(mm) | 长度及公差（mm） Length Range and Tolerance(mm) |
互联条 Interconnect ribbon | 0.15-0.3 ±0.01 | 1-2.5 ±0.05 | 28-500 ±1 |
汇流条 Bus Bar | 0.2-0.4 ±0.01 | 3-8 ±0.05 | 28-1205 ±1 |
其他尺寸可根据客户工艺要求 Other Dimension available according to customer’s technical requirement | |||
