Loading Port:China main port
Payment Terms:TT OR LC
Min Order Qty:25 m.t.
Supply Capability:2000 m.t./month
Silicon Carbide For Abrasives and Refractory
1.Green, crystal structure, high hardness and strong cutting ability, stable chemical characteristics, good thermal conductivity.
2.Among abrasives, silicon carbide’s hardness is higher than corundum, and ranked below diamond, CBN and boron carbide.
3.Density generally viewed is 3.20−3.25g/ mm3 , natural bulk density is 1.2−1.6g/ mm3 , specific gravity is 3.20˜3.25g/ mm3.
Raw material are petroleum coke and quality silicon sand, appended with salt, then smelted in electric arc furnace. Mechanical strength is higher than corundum.
Particle size comparison of commonly used abrasive:
Particle size distribution (micron) | Chemical composition | Physical composition | |||||||
Size | D3 | D50 | D94 | SiC ≥(%) | Fe2O3 ≤(%) | F•C ≤(%) | PH Value | Bulk Density | Magnetic Materials≤(%) |
GC#800 | ≤20.0 | 14.0±1.0 | ≥9.0 | 99.00 | 0.20 | 0.2 | 6--8 | 1.18 | 0.008 |
GC#1000 | ≤18.3 | 11.5±1.0 | ≥7.0 | 98.50 | 0.20 | 0.2 | 6--8 | 1.15 | 0.008 |
GC#1200 | ≤17.5 | 9.5±0.8 | ≥5.5 | 98.50 | 0.20 | 0.2 | 6--8 | 1.13 | 0.005 |
GC#1500 | ≤14.5 | 8.0±0.6 | ≥4.5 | 98.00 | 0.20 | 0.2 | 6--8 | 1.12 | 0.005 |
GC#1800 | ≤13.5 | 7.0±0.6 | ≥4.2 | 98.00 | 0.20 | 0.2 | 6--8 | 1.05 | 0.005 |
GC#2000 | ≤13.0 | 6.7±0.6 | ≥4.0 | 98.00 | 0.20 | 0.2 | 6--8 | 1.00 | 0.005 |
Main applications:
solar and semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non−ferrous metal lapping such as glass, stone, agate and high−grade jewelry; high−grade refractory materials , engineering ceramic, heating elements and thermal elements.
For wire-sawing of solar and semi-conductor
Usage:
Green silicon carbide is used for wire−sawing of monocrystal silicon, polocrystalline silicon, potassium arsenide, quartz crystal etc, it is the engineering processing material in solar photovoltaic industry, semi−conductor industry and piezoelectric crystal industry.
Feature:
1.high purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition.
2.Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cutted.
3.Particle size distribution is narrow and even.
4.High heat−resisting and refractoriness under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.
5.Grain surface possessed specially, micro−powder with clean surface and easily fit cutting fluid, such as polyethyleneglycol and so on.
Company Information
Q1. Will the FREE SAMPLES be provided for buyers?
- YES. We will provided FREE SAMPLE about 1kg
Q2. How about the express fee?
- Our company’s policy is the buyer pay for express fee.
Q3. Is there QUALITY REPORT for the products?
- YES. We provide quality report of our company or CIQ,SGS according to client‘s requirement
