Loading Port:Shenzhen
Payment Terms:L/C,T/T
Min Order Qty:10000 Pcs bag
Supply Capability:100000 Pcs Per Month bag/month
General Introduction
Shenzhen Factory High Brightness SMD5730 LED Chip
Feature
A)Size(mm):5.7*3.0*0.9
B)Emitting Angle:120 degree
C) Soldering Method: re-flow soldering
D)RoHS compliant
E)Dice Material: InGaN
F)Suitable for all SMT assembly and solder process.
Application
A) Optical indicator
B) Indoor lighting
C) Interior automotive lighting
D) Backing for LED,switch and symbol,display
E) Light pipe application
F) Advertisement
Specification
| Part No. | Dice | Lence Type | CRI | Luminous flux | Viewing Angle | |||
| Min. | Max. | Min | Max | 2θ 1/2 | ||||
| 5730W450-1B0 | White(InGaN) | Yellow Diffused | 70 | 87 | 40 | 45 | 120 | |
| 50 | 55 | |||||||
| 55 | 60 | |||||||
Electro-optical characteristics at Ta=25°C
| Parameter | Symbol | Min. | Type | Max. | Units | Test conditions |
| Forward Voltage | VF | 2.8 | 3.0 | 3.6 | V | IF=150mA |
| Reverse Current | IR | — — | — — | 10 | μA | VR=5V |
| Color Coordinates | X | — — | 0.371 | — — | — — | IF=150mA |
| Y | — — | 0.37 | — — | — — | IF=150mA | |
| Color Temperature | TC | 4000 | 4200 | 4500 | K | IF=60mA |
Electro-optical characteristics at Ta=25°C
| Power | Symbol | Rating | Units |
| Power Dissipation | Pd | 500 | mW |
| DC Forward Current | IF | 150 | mA |
| Peak Forward Current[1] | IFP | 200 | mA |
| Reverse Voltage | VR | 5 | V |
| Eletrostatic Discharge(HBM) | ESD | 1000 | V |
| Operating Temperature | Topr | —40-+85 | °C |
| Storage Temperature | Tstg | —40-+100 | °C |
Application notes
A) The LEDs should be kept at 30°C or less and 90@ RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packing with absorbent material(sillica gel) is recommended.
B) The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldred within 24 hours(1days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material(sillica gel). It is also recommennded to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again or it need to rebake before using next time.
Notes
Baking condition:temperature 70°C±5°C;humidity:less than 10%RH
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