Loading Port:China Main Port
Payment Terms:TT OR LC
Min Order Qty:-
Supply Capability:-
Place of Origin: Hebei, China (Mainland)
Brand Name: OEM
Model Number: customized
Number of Layers: 4-Layer
Base Material: FR4 CEM-9 Rogers HF
Copper Thickness: 0.5-5 OZ
Board Thickness: 0.2-6.0mm
Min. Hole Size: 0.2mm
Min. Line Width: 4mil
Min. Line Spacing: 4mil
Surface Finishing: hal immersion gold immersion silver OSP
color: green blue black white red
| Packaging Details: | vaccum / anti-static in carton or as your requirement |
|---|---|
| Delivery Detail: | 7-10 days after getting your payment |
cheap pcba
PCB Manufacturing
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.2mm-7mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,CQC |
| 15 | Profiling Punching | Routing,V-CUT,Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
Requirement
Quote requirement | Gerber file and Bom list |
Clear pics of pcba or pcba sample for us | |
Test method for PCBA | |
Other Detailed quirements | |
Technical requirement | rofessional Surface-mounting and Through-hole soldering Technology |
Various sizes like 1206,0805,0603 components SMT technology | |
ICT(In Circuit Test),FCT(Functional Circuit Test) technology. | |
PCB Assembly With UL,CE,FCC,Rohs Approval | |
Nitrogen gas reflow soldering technology for SMT. | |
High Standard SMT&Solder Assembly Line | |
High density interconnected board placement technology capacity. |
